3D hype is fast wearing out its welcome, but there's at least one area of industry where the buzzed about term could usher in true innovation. Announced today as a joint research project, IBM and 3M will work towards the creation of a new breed of microprocessors. Unlike similar three-dimensional semiconductor efforts by Intel, the two newly partnered outfits plan to stack up to 100 layers of chips atop one another resulting in a microchip "brick." Under the agreement, IBM
