07.09.2011 18:05 Uhr, Quelle: Engadget

IBM and 3M join forces to fab 3D microchips, create mini-silicon skyscraper valley

3D hype is fast wearing out its welcome, but there's at least one area of industry where the buzzed about term could usher in true innovation. Announced today as a joint research project, IBM and 3M will work towards the creation of a new breed of microprocessors. Unlike similar three-dimensional semiconductor efforts by Intel, the two newly partnered outfits plan to stack up to 100 layers of chips atop one another resulting in a microchip "brick." Under the agreement, IBM

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