If manufacturers of consumer grade RAM chips have been facing serious problems during the economic slow down, the main players in the field have pushed R&D Labs to accelerate developments of some technologies to be ready to come up with new products as soon as the global economy would have recovered. The main goal being to engrave RAM chips thinner in order to product more units on the same wafer, and consequently reducing production cost.
Samsung just announced first DDR3 memory chips engraved at 30 nm. With such process in place, power consumption of such chips should decrease by 30% when compared to chips engraved at 50 nm. According to the manufacturer, the yield at 30 nm is higher than at 40 nm, now around 60%.
Such chips should be produced "en masse
