03.02.2026 15:10 Uhr, Quelle: Toms Hardware

Intel is co-developing new Z-Angle Memory to compete with HBM used in AI data centers — vertically-stacked memory touts 2 to 3x more capacity, greater bandwidth, and half the power consumption

Intel and SoftBank subsidiary, Saimemory, have signed a new collaborative agreement to advance the development and manufacture of a new type of vertical-stacked memory known as Z-Angle Memory, or ZAM.

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