13.11.2025 17:00 Uhr, Quelle: Toms Hardware

DARPA invests $1.4 billion to build experimental Texas foundry for next-generation 3D chips — Austin plant to buck standard fab models to focus on high-mix, low-volume production

A new DARPA- and Texas-backed facility will focus on 3D heterogeneous integration, stacking, and combining multiple materials and chip types to advance U.S. capabilities in defense, AI, and HPC.

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