24.04.2025 18:45 Uhr, Quelle: Toms Hardware

TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management for future AI and HPC processors.

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