30.04.2024 19:54 Uhr, Quelle: Toms Hardware

TSMC details 12.8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI

TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs.

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