21.04.2022 16:54 Uhr, Quelle: 9to5Mac

Apple’s M2 chip nears as Samsung beats LG as processor packaging partner

Samsung Electro-Mechanics is collaborating with Apple on creating the M2 chip, beating out LG Innotek. Samsung is developing the flip chip ball grid array (FC-BGA) for the new generation of Apple Silicon for 2022. more…

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