Filed under: Misc. Gadgets
It's been a tick since anyone 'round these parts has taken Peltier cooling seriously, but sure enough, North Carolina-based Nextreme Thermal Solutions is giving us reason to spark that conversation up once more. Its Ultra-High Packing Fraction (UPF) OptoCooler module utilizes "thin-film thermal bump technology at its core," essentially enabling it to be "integrated directly into electronic and optoelectronic packaging to deliver more than 45°C of cooling." Initially, the outfit hopes to have its product embedded within LED packages to "control temperatures and maintain proper operating conditi
