Following their previous announcement about high-k/metal gate semiconductor process technology last January, IBM announced to have reached a new milestone in order to deliver 32nm engraving and low power consuming CPU. Among IBM's partners on this project one can find AMD, Freescale, Infineon, and Samsung. By summing of this technology, IBM expects to deliver 30% speedup potential for existing chip. It should be available to IBM alliance members by H2 2009.
This is IBM's answer to the similar Intel's hafnium-based high-k/metal gate technology, being currently used in all 45nm-based CPUs from Santa Clara's giant. Intel also claims that this technology allowed performance level to be boosted by 30% while maintaining power consumption identical. Intel should also move to 32nm engraving process in 2009.
[translation by Linathael]
