Samsung and Interflex are both ramping up production of flexible printed circuit boards to be use in Apple’s ‘iPhone 8’ later this year, The Korea Hearld reports. The FPCB components are used to connect the dedicated chips for components like the display and camera. Previous reports claimed the new OLED ‘iPhone 8’ will be made with a flexible display, but that the phone itself won’t be bendable or foldable because…
