31.03.2016 01:55 Uhr, Quelle: Macrumors

First iPhone SE Teardown Reveals Mix of iPhone 5s, 6, and 6s Components

With the iPhone SE now available in several countries, the first teardown of the device has been conducted by Chipworks. As expected, the device uses a hodgepodge of components sourced from several past iPhones, including the iPhone 5, 6, and 6s, leading Chipworks to say "this is not your typical Apple release."There are very few new parts, but that hardly means there is no innovation. As is the genius of Apple and its fearless leader, Mr. Cook, it is the combination of all the right parts that make a successful product. Finding that just-right balance of old and new, and at such a low cost, is no easy feat.The processor inside the iPhone SE is indeed the same A9 processor found in the iPhone 6s, and the part in the iPhone SE Chipworks took apart was labeled with an APL1022 part number from a TSMC facility. It includes SK Hynix memory, which Chipworks says is likely the same 2GB LPDDR4 DRAM module found in the iPhone 6s. The date codes might actually tell a story: the decapped application processor chip is da

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