The U.S. Patent and Trademark Office today published an Apple patent application (via AppleInsider) filed in February of this year which addresses a system for packaging fingerprint sensors alongside conductive bezels in a single structure. The bezels deliver a small amount of electrical current to the user's finger, allowing the fingerprint to be read by the sensor.The present disclosure is related to integrated circuit packaging, and more specifically to methods and apparatus for integrally molding a die and one or more bezel structures, with portions of each exposed or at most thinly covered, for fingerprint sensors and the like.
