Digitimes reports that Taiwan Semiconductor Manufacturing Company (TSMC) will "tape out" the design for an A7 system-on-a-chip built on a 20-nanometer process this month. Taping out refers to the initial design of the chip having been completed for creation of the masks that will be used to print the actual chips, although further tweaks are likely as test production is carried out.Taiwan Semiconductor Manufacturing Company (TSMC) is expected to tape out Apple's A7 processor on a 20nm process in March and then move the chip into risk production in May-June, which will pave the way for commercial shipments in the first quarter of 2014, according to industry sources.The report claims that TSMC will be using its "14-fab" facility at the Tainan Science Park in
