18.11.2011 00:35 Uhr, Quelle: Engadget

IBM sees stacked silicon sitting in fluid as the way to power future PCs

Generally, the combination of microchips, electricity and fluids is usually considered an incredibly bad thing. IBM, however, thinks it can combine those three to make super small and super powerful computers in the future. The idea is to stack hundreds of silicon wafers and utilize dual fluidic networks between them to create 3D processors. In such a setup, one network carries in charged fluid to power the chip, while the second carries away the same fluid after it has picked up heat from the active transistors. Of course, 3D chips are already on the way, and liquid cooled components are nothing new, but powering a PC

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