Outside of the occasional leaked roadmap, one of the best ways to predict the future of consumer electronics is by looking at the evolution of the components within. Take this Toshiba NAND package for instance. While the launch of a 64GB embedded NAND flash memory module (the highest capacity in the industry) that combines sixteen 32Gb NAND chips fabricated with 32nm manufacturing processes might sound a bit boring, consider its uses. As you'll recall from the iPhone 3GS teardown, Apple's lovely uses either a single 16GB or 32GB Toshiba NAND module depending on the model purchased. The fact that Toshiba is now sampling its new
