Oh sure, liquid cooling rigs are all the rage, but they aren't too useful within minuscule things like netbooks, MIDs and pocket projectors. The always churning minds over at Fraunhofer-Gesellschaft are already on the issue, recently conjuring up a new material designed to "efficiently dissipate heat even in devices with densely packed components and that can give increasingly miniaturized electronics a longer life." Researchers at the entity's Institute for Manufacturing Engineering and Applied Materials Research have teamed with gurus from Siemens and Plansee to create the substance as part of the EU project "ExtreMat." Unfortunately, de
