04.09.2024 19:27 Uhr, Quelle: Engadget

Intel’s next-gen chip manufacturing process reportedly hits snag after failing crucial tests

Intel’s been trying to recapture its glory days and establish itself, once again, as a leading chipmaker. However, this dream has run into a major snag. The company’s next-gen manufacturing process, currently referred to as 18A, has reportedly failed crucial tests, according to Reuters. Semiconductor developer Broadcom helped conduct these tests as part of an evaluation process for a potential order. The report indicates that Intel sent Broadcom’s silicon wafers, which are the components used to form the base of a semiconductor, through the 18A manufacturing process, which is supposed to increase efficiency. Broadcom was reportedly not happy with the results, suggesting that Intel’s new-fangled manufacturing process isn’t ready for high-volume production. A Broadcom spokesperson said the company is "evaluating the product and service offerings of Intel Foundry and have not concluded that evaluation." Intel had planned on using this new process to produce chips for major partners

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