12.02.2008 01:21 Uhr, Quelle: 9to5Mac

Broadcom to unveil 3G iPhone Chip (BCM21551) at 2008 Mobile World Congress this week in Barcelona?

Broadcom is set to unveil today what many think will be the heart of the 3G iPhone's communications chips.  The BCM21551 3G System on a Chip (SoC) from longtime Apple partner, Broadcom, offers: Broadcom's new BCM21551 single-chip 3G SoC processor with HSUPA functionality for high bandwidth transfers of data to mobile devices. The new baseband solution enables manufacturers to build next generation 3G smartphones with breakthrough features, sleek form factors and extended battery life. Broadcom will also be demonstrating the BCM21331 single-chip 2G SoC, enabling a range of cost effect new handset devices.

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