Apple chip partner TSMC will issue bonds worth NT$21.1 billion (US$743 million), in a bid to fund efforts to expand its production, allowing it to make more chips like Apple Silicon.On March 1, it was reported that TSMC was preparing a bond sale to add more funds to its war chest for expansion. While earlier reports indicated the plans involved bonds worth NT$16 billion (US$565 million), the actual amount it intends to raise is a much higher figure.In a resolution approved by the board of directors, TSMC will offer NT$21.1 billion in unsecured bonds, according to Digitimes. The bonds will consist of a five-year group worth NT$4.8 billion with a 0.5% coupon rate, along with a seven-year version with a 0.55% coupon rate at NT$11.4 billion, and a 10-year tranche for NT$4.9 billion with a 0.6% coupon rate.Read more
