Longtime rivals Intel and AMD are joining forces to produce new 8th-Generation H-Series Intel mobile processors paired with stacked second-generation High Bandwidth Memory and custom-built discrete graphics from AMD, Intel announced today.
For the new H-Series chips, which feature all of the above listed components in a single processor package, Intel says is using its Embedded Multi-Die Interconnect Bridge (EMIB), a power-sharing framework that reduces the standard silicon footprint to less than half that of standard discrete components on a motherboard.At the heart of this new design is EMIB, a small intelligent bridge that allows heterogeneous silicon to quickly pass information in extremely close proximity. EMIB eliminates height impact as well as manufacturing and design complexities, enabling faster, more powerful and more efficient products in smaller sizes. This is the first consumer product that takes advantage of EMIB.Intel has also developed unique software drivers and interfaces for the discrete G
