Semiconductor companies Amkor Technology and STATS ChipPAC will each handle 40% of the packaging orders placed by Apple for its upcoming A8 processor, while Advanced Semiconductor Engineering (ASE) will obtain the remaining 20% of the orders, according to a new report from DigiTimes. Apple's A8 chip will be a package-on-package (PoP) SoC solution comprising processors and mobile DRAM in a single package, said the sources. Taiwan Semiconductor Manufacturing Company (TSMC) is also believed to have secured wafer-bumping orders for the processor, and will reportedly start ramping up production of the A8 chip using 20nm process technology in the second quarter of 2014, with the processor widely expected to be used in Apple's
