The Hybrid Memory Cube Consortium has been almost too patient in developing a standard for for its eponymous technology -- efforts began 17 months ago -- but it at last has more than good intentions to show for its work. Its just-published HMC Specification 1.0 lets companies build platforms and RAM with 2GB, 4GB and 8GB chips incorporating the stacked, power-efficient technology, all without compatibility jitters from other supporters. The completed spec is a scorcher when living up to its full potential, too. With eight links, a memory cube can reach a peak 320GB/s (yes, that's g
