24.06.2013 21:20 Uhr, Quelle: The Register

Apple said to dump Samsung as chip-baking partner – again

Yes, it's déjà vu all over again, but this time it might be true A report coursing about the interwebs claims that Apple is dumping its iDevice chip partnership with über-rival Samsung, and has inked a three-year deal with Taiwanese wafer-baker TSMC and its "IC design service partner" Global UniChip to manufacture A8, A9, and A9X chips at the 20nm, 16nm, and 10nm process nodes.…

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