12.04.2012 20:50 Uhr, Quelle: MacNN

Apple patents ultrasonic bonding process for earbuds

Apple may be planning to update the earbuds it bundles with its iPod and iPhone products in the future, as indicated by a newly discovered patent filing. It involves a process called ultrasonic welding and would make for a seamless-looking product, something Apple is a big proponent of in the iMac and other devices. The resulting product would have a "seamless unibody structure," according to Apple.

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