04.04.2012 11:20 Uhr, Quelle: Wallstreet online

MarketsandMarkets: Global 3D IC and TSV Interconnect Market worth $6.55 Billion by 2016

DALLAS, April 4, 2012 /PRNewswire/ According to a new market research report "Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology …

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